• Removal leaves little or no residue
  
• Masking off PCBs for IR reflow ovens or wave soldering under 572°F (300°C) ~ 10 seconds
  
• Near zero voltage generation when tape removed from PCB (at 50% relative humidity)
  
• Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)
  
• Low-sloughing plastic core
  
• Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
  
• For best results apply to board using a rubber roller
  
• Adhesive surface resisitivity
  10E3 to 10E4 Ohms
• Max Temperature
  572°F (300°C) 10 seconds
• Adhesive Strength
  1 N/cm (DIN), 5 oz/in² (ASTM)
• 1.0 mil thick (0.0254mm) Polyimide Film (DuPont Kapton® or equivalent)
  
• Conductive Polysiloxide Adhesive
  
• Total Thickness
  0.060 mm (DIN), 2.4 mil (ASTM)
• Color
  Brown opaque
• Adhesive Type
  Silicone
• Tensile Strength
  50 N/cm (DIN), 28 lbs/in² (ASTM)
• Elongation
  70% (DIN & ASTM)
• Lead-free RoHS compliant

The user must determine the suitability for use of an antistatic tape for particular applications, and should reevaluate suitability one year after purchase date.

Note: Tapes store best when laid flat in a dry, well ventilated room with a reasonably consistent temperature of 20° C (68° F) and are protected from exposure to direct sunlight.