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- Removal leaves little or no residue
- Masking off PCBs for IR reflow ovens or wave soldering under 572°F (300°C) ~ 10 seconds
- Near zero voltage generation when tape removed from PCB (at 50% relative humidity)
- Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)
- Low-sloughing plastic core
- Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
- For best results apply to board using a rubber roller
- Adhesive surface resisitivity
10E3 to 10E4 Ohms
- Max Temperature
572°F (300°C) 10 seconds
- Adhesive Strength
1 N/cm (DIN), 5 oz/in2 (ASTM)
- 1.0 mil thick (0.0254mm) Polyimide Film (DuPont Kapton® or equivalent)
- Conductive Polysiloxide Adhesive
- Total Thickness
0.060 mm (DIN), 2.4 mil (ASTM)
- Color
Brown opaque
- Adhesive Type
Silicone
- Tensile Strength
50 N/cm (DIN), 28 lbs/in2 (ASTM)
- Elongation
70% (DIN & ASTM)
- Lead-free RoHS compliant
ANSI/ESD S20.20 requires that all nonessential insulators, such as those made of plastics and paper, must be removed from the workstation. Substituting antistatic tape for regular tape (a very high tribocharging insulator) protects your ESD susceptible products.
The user must determine the suitability for use of an antistatic tape for particular applications, and should reevaluate suitability one year after purchase date.
Note: Tapes store best when laid flat in a dry, well ventilated room with a reasonably consistent temperature of 20° C (68° F) and are protected from exposure to direct sunlight.
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