• Antistatic, low tribocharging
  Minimizes charge generation; material will conduct charges if grounded
• Dissipative - corrosion resistant
  Ideal for long term storage
• Uniform protection
  Will not affect the solderability of device leads
• Lead-free RoHS Compliant
• Made in the United States of America

High Density Foam is ideal for lead insertion packaging, providing ESD and physical protection to component leads, and bringing terminals to equipotential, minimizing exposure to discharge.

Size: 24" x 36"
Volume Resistivity: 10E3 - 10E5 ohms
Surface Resistivity: 10E3 - 10E5 ohms